WLR (Wafer Level Reliability) testing is a specialized testing method used to assess the reliability of semiconductor devices at the wafer stage. This method directly tests chip reliability at the wafer level to ensure that the devices meet quality and lifetime requirements. WLR testing involves a series of rigorous stress tests such as Hot Carrier Injection (HCI), Bias Temperature Instability (BTI), Electromigration (EM), Time-Dependent Dielectric Breakdown (VTDDB), and Voltage Ramp Dielectric Breakdown (VRAMP). These tests simulate device operation under various extreme conditions, helping engineers identify and improve weak points in the process to enhance overall product reliability.

WLR testing finds widespread application in the manufacturing processes of various semiconductor devices, particularly in sectors with high performance and high reliability demands like automotive electronics, communication devices, consumer electronics, and industrial control. Through WLR testing, manufacturers can ensure the stability and durability of their products in real scenarios, meeting customer needs for high-quality electronic products.